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Functional Surfaces
CVD Equipment
Vacuum Applications
MCM utilize the most efficient all-dry polymer coating techniques; plasma-enhanced chemical vapor deposition (PECVD) and hot-filament activated chemical vapor deposition (HFCVD). In both techniques, substrate to be coated are not exposed high temperatures, solvents, or other harsh conditions. They are both bottom-up process, meaning that polymer thin films are produced from monomeric building blocks just on the substrate surface, through different polymerization mechanisms. The two techniques differ from each other in the way that polymerization reactions are activated.
PECVD
In PECVD, a plasma discharge of a specific monomer is produced with a plasma generator. The active species responsible for film-forming reactions are produced in the plasma glow. Fast deposition rates can be achieved easily through our patent-pending inductively-coupled RF plasma system having an outer planar antenna.
Please see the Iconium-P series CVD system for detailed system descriptions. Various reactor and plasma coupling configurations are possible, depending on your applications.
HFCVD
In HFCVD, a resistively-heated filament array is placed a few centimeters above the substrate surface. The precursors are activated in the vicinity of heated filaments, while substrate is kept at low temperatures. The film-forming reactions occur on the substrate surface, through a surface reaction, which is analogous to the free-radical chain polymerization carried in solution medium.
Please see the Iconium-HF series CVD system for detailed system descriptions. Various reactor and filament array configurations are possible, depending on your applications.